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Description & Specification
NP-535H High-Frequency RF Laminate
Dk 3.45 | Df 0.0033 | RO4533 Equivalent | Tg 180°C
The NP-535H is an elite-tier Microwave Substrate designed for mission-critical RF environments requiring high-frequency stability and ultra-low loss. With a glass transition temperature (Tg) of 180°C and a Passive Intermodulation (PIM) rating of ≤-153 dBc, it ensures mechanical and signal dominance during high-temperature operation. Engineered for professional Signal Defense, high-gain Antenna arrays, and power amplifiers, this laminate provides designers with greater flexibility by maintaining consistent impedance matching across the spectrum.
Core Electrical Specifications
| Dielectric Constant (Dk) @ 10GHz | 3.45 (Design) / 3.50 (Process) |
| Dissipation Factor (Df) @ 10GHz | 0.0033 (Typical) / 0.0034 (Conditioned) |
| Passive Intermodulation (PIM) | ≤ -153 dBc |
| Glass Transition Temp (Tg) | 180°C (DMA) |
| Dielectric Breakdown | 60 KV |
| Volume / Surface Resistivity | 5x10⁸ MΩ-cm / 6x10⁷ MΩ |
Physical & Thermal Parameters
| Substrate Thickness Options (mm) | 0.10 / 0.13 / 0.25 / 0.50 / 0.76 / 1.0 / 1.2 / 1.52 |
| Copper Cladding (oz) | 0.5 oz / 1.0 oz |
| Copper Thickness (mm) | 0.018 mm / 0.035 mm |
| Td (Decomposition Temp) | 360°C (5% weight loss) |
| Moisture Absorption | 0.01% ～ 0.02% |
| Flammability Rating | UL94 94V0 |
Key Tactical Features
Superior Signal Integrity
The stable 3.45 Dk and low 0.0033 Df minimize signal attenuation and phase error in high-frequency circuits, essential for wideband satellite sub-systems.
Thermal Stability Dominance
A Tg of 180°C combined with low Z-axis CTE (50-80 ppm/°C) ensures consistent electrical performance and plated-through-hole reliability during thermal stress.
Design Flexibility
Allows for consistent impedance design across multiple dielectric thicknesses, providing greater engineering freedom for complex multilayer RF stack-ups.
Low Moisture Sensitivity
Ultra-low moisture absorption (0.01%) prevents dielectric drift and mechanical failure in high-humidity field tactical deployments or aerospace environments.
Get a Quote / Technical Support
Contact us for customized panel sizes, specific copper treatments (RTF/VLP), or Rogers RO4533 equivalent material analysis.
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Made in Taiwan
| Dielectric Constant (DK): | 2.6 @ 10 GHz |
| Dissipation Factor (DF): | 0.0018 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Technical Standard: | Professional RF Grade |
Made in Taiwan
| Dielectric Constant (Dk): | 2.2 @ 10 GHz |
| Dissipation Factor (Df): | 0.0009 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.0 @ 10 GHz |
| Dissipation Factor (Df): | 0.0022 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.66 @ 10 GHz |
| Dissipation Factor (Df): | 0.0030 @ 10 GHz |
| Thermal Conductivity: | 0.70 W/m.k |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.55 @ 10 GHz |
| Dissipation Factor (Df): | 0.0031 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Copper Foil (oz): | 1 / 0.5 oz |
Made in Taiwan
| Design Permittivity (Dk): | 3.52 @ 10 GHz |
| Loss Tangent (Df): | 0.0035 @ 10 GHz |
| Glass Transition (Tg): | > 210 °C (DMA) |
| Flammability: | UL 94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 2.98 @ 10 GHz |
| Dissipation Factor (Df): | 0.003 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
