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Total payment:
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Description
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Short Specs
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Details Specs
- Low dielectric constant and low dissipation factor at the high-frequency range
- Tg:180 (DMA)
- Suit for Antenna、PA and LNB application
- Greater design flexibility by allowing the same impedance
| Dk (10GHz) |
Df (10GHz) |
Dielectric Thickness (mm) |
Copper foil (oz) |
Copper Thickness (mm) |
Equivalent |
| 3.45 | 0.0033 | 0.10 0.13 0.25 0.50 0.76 1.0 1.2 1.52 |
1 | 0.035 | RO4533 IS680 |
| 0.5 | 0.018 |
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Characteristics |
Unit |
Conditioning |
Typical Values |
SPEC |
Test Method |
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|
Permittivity |
Process |
- |
10GHz/23℃ |
3.50 |
- |
2.5.5.5 |
|
Design |
- |
3.45 |
Differential phase length |
|||
|
Loss Tangent |
- |
10GHz/23℃ |
0.0034 |
- |
2.5.5.5 |
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|
0.0033 |
SPDR |
|||||
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Volume resistivity |
MΩ-cm |
C-96/35/90 |
5x 108~6 x 109 |
106 h |
2.5.17 |
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Surface resistivity |
MΩ |
C-96/35/90 |
6 x 107~6 x 108 |
104 h |
2.5.17 |
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Arc resistance |
SEC |
D-48/50+D-0.5/23 |
450h |
60 h |
2.5.1 |
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Dielectric breakdown |
KV |
D-48/50 |
60 h |
40 h |
2.5.6 |
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Moisture absorption |
% |
D-24/23 |
0.01~0.02 |
0.35 i |
2.6.2.1 |
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Flammability |
- |
C-48/23/50 |
94V0 |
94V0 |
UL94 |
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Peel strength 1 oz |
lb/in |
288℃x10” solder floating |
5~7 |
- |
2.4.8 |
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Thermal stress |
SEC |
288℃ dipping |
300 h |
10 h |
2.4.13.1 |
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Pressure cooker 2 hr (2 atm 121℃) |
SEC |
288℃ dipping |
300 h |
N/A |
- |
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Dimensional stability X-Y axis |
% |
E-0.5/170 |
0.010-0.030 |
0.050 i |
2.4.39 |
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Coefficient of thermal expansion Z-axis before Tg |
ppm/℃ |
TMA |
50-80 |
N/A |
2.4.24 |
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Glass transition temp |
℃ |
DMA |
180 |
N/A |
2.4.25 |
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Td (5% weight loss) |
℃ |
TGA, 10℃/min |
360 |
325 h |
- |
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PIM |
dBc |
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,-153 |
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New Products
Related Products
- DK (10 GHz): 2.6
- DF (10 GHz): 0.0018
- Copper foil (oz): 1/0.5
- Copper Thickness: 0.035/ 0.018
- DK (10 GHz): 2.2
- DF (10 GHz): 0.0009
- Copper foil (oz): 1/0.035
- Copper Thickness: 0.5/ 0.018
- DK (10 GHz): 3
- DF (10 GHz): 0.0022
- Copper foil (oz): 1/0.035
- Copper Thickness: 0.5/ 0.018
- Low dielectric constant and low dissipation factor at high-frequency range
- High thermal conductivity
- Excellent dimensional stability
- Greater design flexibility by allowing the same impedance
- Suit for Antenna、PA and LNB application
- Manufacturer: Nan Ya Plastic
- DK (10 GHz): 3.55
- DF (10 GHz): 0.0031
- Copper foil (oz): 1/0.035
- Copper Thickness: 0.5/ 0.018
- Super low dissipation factor at high frequency range
- Rheology of resin controlled to benefit the lamination of the boards.
- Flammability meets UL 94 V-0
- DK (10 GHz): 2.98
- DF (10 GHz): 0.003
- Copper foil (oz): 1/0.5
- Copper Thickness: 0.035/ 0.018
