NP-535 NP-535 NP-535

Model No: NP-535

Product Datasheet: Download

  • DK (10 GHz): 3.45
  • DF (10 GHz): 0.0033
  • Copper foil (oz): 1/0.035
  • Copper Thickness: 0.5/ 0.018
Quantity:
INQUIRY
  • Low dielectric constant and low dissipation factor at the high-frequency range      
  • Tg:180 (DMA)   
  • Suit for Antenna、PA and LNB application
  • Greater design flexibility by allowing the same impedance
Dk
(10GHz)
Df
(10GHz)
Dielectric Thickness
(mm)
Copper foil
(oz)
Copper Thickness
(mm)
Equivalent
3.45 0.0033 0.10
0.13
0.25
0.50
0.76
1.0
1.2
1.52
1 0.035 RO4533
IS680
0.5 0.018

Characteristics

Unit

Conditioning

Typical Values

SPEC

Test Method

Permittivity

Process

-

10GHz/23℃

3.50

-

2.5.5.5

Design

-

3.45

Differential

phase length

Loss Tangent

-

10GHz/23℃

0.0034

-

2.5.5.5

0.0033

SPDR

Volume resistivity

MΩ-cm

C-96/35/90

5x 108~6 x 109

106 h

2.5.17

Surface resistivity

C-96/35/90

6 x 107~6 x 108

104 h

2.5.17

Arc resistance

SEC

D-48/50+D-0.5/23

450h

60 h

2.5.1

Dielectric breakdown

KV

D-48/50

60 h

40 h

2.5.6

Moisture absorption

%

D-24/23

0.01~0.02

0.35 i

2.6.2.1

Flammability

-

C-48/23/50

94V0

94V0

UL94

Peel strength 1 oz

lb/in

288℃x10” solder floating

5~7

-

2.4.8

Thermal stress

SEC

288℃ dipping

300 h

10 h

2.4.13.1

Pressure cooker 2 hr

(2 atm 121)

SEC

288℃ dipping

300 h

N/A

-

Dimensional stability X-Y axis

%

E-0.5/170

0.010-0.030

0.050 i

2.4.39

Coefficient of thermal expansion

Z-axis before Tg

 

ppm/℃

 

TMA

 

50-80

N/A

2.4.24

Glass transition temp

DMA

180

N/A

2.4.25

Td (5% weight loss)

TGA, 10℃/min

360

325 h

-

PIM

dBc

 

,-153