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Description & Specification
NP-536HC High-Frequency Microwave Laminate
Nan Ya Plastics | Dk 3.66 | Df 0.0030 | High Thermal Conductivity
The NP-536HC is a high-performance Microwave Substrate engineered for superior electrical stability in demanding RF environments. With a design Dk of 3.66 and exceptionally low dissipation, it provides advanced impedance control for high-frequency circuits. Specifically developed for Antenna arrays, Power Amplifiers, and LNB components, it combines superior thermal conductivity (0.70 W/m.k) with ultra-low moisture absorption (0.008%) to maintain maximum signal dominance and mechanical survival in the hardest environmental conditions.
Core Electrical Specifications
| Dielectric Constant (Dk) @ 10GHz | 3.66 (Design) / 3.76 (Process) |
| Dissipation Factor (Df) @ 10GHz | 0.0030 (Typical) / 0.0032 (Conditioned) |
| Dielectric Breakdown | 60 KV |
| Volume / Surface Resistivity | 5x10⁹ MΩ-cm / 6x10⁸ MΩ |
| Arc Resistance | 450 SEC |
Physical & Thermal Parameters
| Dielectric Thickness Options (mm) | 0.15 / 0.27 / 0.53 / 0.78 / 1.0 / 1.2 / 1.54 |
| Copper Cladding (oz) | 0.5 oz / 1.0 oz |
| Td (Decomposition Temp) | 410°C (5% weight loss) |
| Thermal Conductivity | 0.70 W/m.k |
| Moisture Absorption | 0.008% ~ 0.015% |
| Flammability Rating | UL94 94V0 |
Key Tactical Features
High Thermal Management
Equipped with 0.70 W/m.k thermal conductivity, ensuring efficient heat dissipation in high-power Amplifiers and active protection sub-systems.
Superior Signal Integrity
The stable Dk and low Df minimize insertion loss and phase errors, critical for high-gain satellite LNBs and phased-array antennas.
Design Flexibility
Allows for consistent impedance design across multiple dielectric thicknesses, providing greater engineering freedom in complex RF stack-ups.
Environmental Resilience
Ultra-low moisture absorption and excellent dimensional stability (0.008%) prevent dielectric drift in high-humidity field tactical deployments.
Get a Quote / Technical Support
Contact us for customized dielectric stack-ups, specific copper foil surface treatments, or Rogers/Taconic equivalent analysis.
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Made in Taiwan
| Dielectric Constant (DK): | 2.6 @ 10 GHz |
| Dissipation Factor (DF): | 0.0018 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Technical Standard: | Professional RF Grade |
Made in Taiwan
| Dielectric Constant (Dk): | 2.2 @ 10 GHz |
| Dissipation Factor (Df): | 0.0009 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.0 @ 10 GHz |
| Dissipation Factor (Df): | 0.0022 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.55 @ 10 GHz |
| Dissipation Factor (Df): | 0.0031 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Copper Foil (oz): | 1 / 0.5 oz |
Made in Taiwan
| Design Permittivity (Dk): | 3.52 @ 10 GHz |
| Loss Tangent (Df): | 0.0035 @ 10 GHz |
| Glass Transition (Tg): | > 210 °C (DMA) |
| Flammability: | UL 94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.45 @ 10 GHz |
| Dissipation Factor (Df): | 0.0033 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 2.98 @ 10 GHz |
| Dissipation Factor (Df): | 0.003 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
