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Total payment:
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Dk (10GHz) |
Df (10GHz) |
Dielectric Thickness (mm) |
Copper foil (oz) |
Copper Thickness (mm) |
3.66 | 0.003 | 0.15 0.27 0.53 0.78 1.0 1.2 1.54 |
1 | 0.035 |
0.5 | 0.018 |
Characteristics |
Unit |
Conditioning |
Typical Values |
SPEC |
Test Method |
|
Permittivity |
Process |
- |
10GHz/23℃ |
3.76 |
- |
2.5.5.5 |
Design |
- |
3.66 |
Differential phase length |
|||
Loss Tangent |
- |
10GHz/23℃ |
0.0032 |
- |
2.5.5.5 |
|
0.0030 |
SPDR |
|||||
Volume resistivity |
MΩ-cm |
C-96/35/90 |
4x 108~5 x 109 |
106 h |
2.5.17 |
|
Surface resistivity |
MΩ |
C-96/35/90 |
6 x 107~6 x 108 |
104 h |
2.5.17 |
|
Arc resistance |
SEC |
D-48/50+D-0.5/23 |
450h |
60 h |
2.5.1 |
|
Dielectric breakdown |
KV |
D-48/50 |
60 h |
40 h |
2.5.6 |
|
Moisture absorption |
% |
D-24/23 |
0.008~0.015 |
0.35 i |
2.6.2.1 |
|
Flammability |
- |
C-48/23/50 |
94V0 |
94V0 |
UL94 |
|
Peel strength 1 oz |
lb/in |
288℃x10” solder floating |
5~7 |
- |
2.4.8 |
|
Thermal stress |
SEC |
288℃ dipping |
300 h |
10 h |
2.4.13.1 |
|
Pressure cooker 2 hr (2 atm 121℃) |
SEC |
288℃ dipping |
300 h |
N/A |
- |
|
Dimensional stability X-Y axis |
% |
E-0.5/170 |
0.008-0.018 |
0.050 i |
2.4.39 |
|
Coefficient of thermal expansion Z-axis before Tg |
ppm/℃ |
TMA |
30-60 |
N/A |
2.4.24 |
|
Td (5% weight loss) |
℃ |
TGA, 10℃/min |
410 |
325 h |
- |
|
Thermal conductivity |
W/m.k |
E-0.5/120 |
0.70 |
N/A |
ASTM D5470 |