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Description & Specification
NP-826 High-Frequency Microwave Laminate
PTFE Substrate | Dk 2.60 | Df 0.0018 | Ultra-Low Moisture Absorption
The NP-826 is an elite-tier Microwave Substrate designed for ultra-stable dielectric performance in the C-band, X-band, and beyond. Utilizing a high-purity PTFE matrix, it delivers a design Dk of 2.60 with remarkable thermal stability (71 ppm/°C). Engineered for mission-critical Signal Defense, power amplifiers, and satellite LNBs, it maintains superior peel strength (11-13 lb/in) and dimensional stability, ensuring unwavering mechanical survival and RF precision in the hardest environmental conditions.
Core Electrical Specifications
| Dielectric Constant (Dk) @ 10GHz | 2.60 (Process & Design) |
| Dissipation Factor (Df) @ 10GHz | 0.0018 (Typical) / 0.0024 (Conditioned) |
| Passive Intermodulation (PIM) | -159 dBc (Typical) |
| Thermal Coefficient of εr | 71 ppm/°C |
| Dielectric Breakdown | 20 KV |
| Volume / Surface Resistivity | 10⁹ MΩ-cm / 10⁸ MΩ |
Physical & Thermal Parameters
| Substrate Thickness Options (mm) | 0.25 / 0.50 / 0.76 / 1.52 / 3.21 |
| Copper Cladding (oz) | 0.5 oz / 1.0 oz |
| Copper Thickness (mm) | 0.018 mm / 0.035 mm |
| Td (Decomposition Temp) | 540°C (5% weight loss) |
| Moisture Absorption | 0.03% (D-24/23) |
| Flammability Rating | UL94 V-0 |
Key Tactical Features
Millimeter-Wave Precision
The stable Dk and ultra-low Df minimize insertion loss and phase error, essential for phased-array antennas and Signal Integrity dominance.
Thermal Stability Dominance
With a decomposition temperature of 540°C and excellent dimensional stability (0.01%), this laminate survives high-power amplification heat cycles.
Advanced Shielding Integrity
Low PIM ratings (<-153 dBc spec) ensure minimal noise interference in high-sensitivity receivers and tactical communication sub-systems.
Environmental Resilience
Extremely low moisture absorption (0.03%) prevents dielectric shifts in high-humidity tactical field deployments or aerospace applications.
Get a Quote / Technical Support
Contact us for customized panel sizes, different copper foil treatments (RTF/VLP), or hybrid stack-up recommendations.
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Made in Taiwan
| Dielectric Constant (Dk): | 2.2 @ 10 GHz |
| Dissipation Factor (Df): | 0.0009 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.0 @ 10 GHz |
| Dissipation Factor (Df): | 0.0022 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.66 @ 10 GHz |
| Dissipation Factor (Df): | 0.0030 @ 10 GHz |
| Thermal Conductivity: | 0.70 W/m.k |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.55 @ 10 GHz |
| Dissipation Factor (Df): | 0.0031 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Copper Foil (oz): | 1 / 0.5 oz |
Made in Taiwan
| Design Permittivity (Dk): | 3.52 @ 10 GHz |
| Loss Tangent (Df): | 0.0035 @ 10 GHz |
| Glass Transition (Tg): | > 210 °C (DMA) |
| Flammability: | UL 94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.45 @ 10 GHz |
| Dissipation Factor (Df): | 0.0033 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 2.98 @ 10 GHz |
| Dissipation Factor (Df): | 0.003 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
