NP-730 NP-730 NP-730

Model No: NP-730

Product Datasheet: Download

  • DK (10 GHz): 3
  • DF (10 GHz): 0.0022
  • Copper foil (oz): 1/0.035
  • Copper Thickness: 0.5/ 0.018
Quantity:
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Features:                                                           

  • Stable dielectric constant  
  • Low moisture absorption    
  • Excellent dimensional stability
  • Ultra-low loss
  • Excellent peel strength    
  • Low PIM   

Applications:

  • Base Station Antennas
  • 5G Infrastructure
  • RF Passive Components
  • Power Amplifiers (PA)
Dk
(10GHz)
Df
(10GHz)
Dielectric Thickness
(mm)
Copper foil
(oz)
Copper Thickness
(mm)
Equivalent
3.0 0.0022 0.25
0.5
0.76
1.52
3.2
1 0.035 AD300C 
SCGA 500 GF300 
ZYF300CA
0.5 0.018

Characteristics

Unit

Conditioning

Typical Values

SPEC

Test Method

Permittivity

Process

-

10GHz/23℃

3.0

-

2.5.5.5

Design

-

3.0

Differential

phase length

Loss Tangent

-

10GHz/23℃

0.0026

-

2.5.5.5

0.0028

SPDR

Thermal Coefficient of Dkr

ppm/°C

10 GHz - 50 to 150 °C

76

 

IPC-TM-650 2.5.5.13

Volume resistivity

MΩ-cm

C-96/35/90

109

106 h

IPC-TM-650 2.5.17

Surface resistivity

C-96/35/90

108

104 h

IPC-TM-650 2.5.17

Arc resistance

SEC

D-48/50+D-0.5/23

180h

60 h

IPC-TM-650 2.5.1

Dielectric breakdown

KV

D-48/50

45h

20 h

IPC-TM-650 2.5.6

Td (5% weight loss)

TGA, 10℃/min

540

450 h

ASTM D3850

CTE (z) (25 - 260°C)

ppm/℃

TMA

70-90

N/A

IPC-TM-650 2.4.24

CTE (x,y) (25 - 260°C)

ppm/℃

TMA

20-30

N/A

IPC-TM-650 2.4.24

Thermal stress

SEC

288℃x10” solder dipping

300 h

10h

IPC-TM-650 2.4.13.1

Peel strength 1 oz

lb/in

288℃x10” solder floating

10

6h

IPC-TM-650 2.4.8

Moisture absorption

%

D-24/23

0.04

0.15↓

IPC-TM-650 2.6.2.1

Density (Specific Gravity)

g/cm3

 

2.1

2.05~2.15

ASTM D792

Flammability

-

C-48/23/50

V-0

V-0

UL94

Thermal Conductivity

W/mK

 

0.6

0.2h

ASTM F 433

Dimensional stability X-Y axis

%

E-0.5/170

0.01-0.03

0.05↓

IPC-TM-650 2.4.39

Passive Intermodulation

dBc

 

158

<-153

: IEC-62037