-
-
-
Total payment:
-
-
Description & Specification
NP-730 High-Frequency Microwave Substrate
PTFE Matrix | Dk 3.00 | Df 0.0022 | 5G Infrastructure Optimized
The NP-730 is an elite-tier Microwave Laminate engineered for high-density RF environments. With a design Dk of 3.00 and industrial-leading Passive Intermodulation (PIM) control (-158 dBc), it ensures consistent electrical stability across diverse conditions. Specifically developed for Signal Defense, 5G base stations, and high-power amplifiers, it combines superior thermal conductivity (0.6 W/mK) with ultra-low moisture absorption (0.04%) to maintain maximum network integrity and mechanical survival in the hardest environmental conditions.
Core Electrical Specifications
| Dielectric Constant (Dk) @ 10GHz | 3.00 (Process & Design) |
| Dissipation Factor (Df) @ 10GHz | 0.0022 (Typical) / 0.0026 (Conditioned) |
| Passive Intermodulation (PIM) | -158 dBc (Typical) / < -153 (Spec) |
| Thermal Coefficient of Dkr | 76 ppm/°C |
| Dielectric Breakdown | 45 KV |
| Volume / Surface Resistivity | 10⁹ MΩ-cm / 10⁸ MΩ |
Physical & Thermal Parameters
| Substrate Thickness (mm) | 0.25 / 0.50 / 0.75 / 1.52 |
| Copper Cladding (oz) | 0.5 oz / 1.0 oz / 2.0 oz |
| Td (Decomposition Temp) | 540°C (5% weight loss) |
| Thermal Conductivity | 0.6 W/mK |
| Moisture Absorption | 0.04% (Typical) |
| Dimensional Stability (X-Y) | 0.01 - 0.03% |
Key Tactical Features
5G Infrastructure Dominance
Ultra-low loss tangent and stable Dk support the rigorous high-frequency requirements of 5G base stations, ensuring superior Signal Integrity.
Advanced PIM Management
Rated at -158 dBc, this substrate minimizes noise and interference in high-sensitivity receivers and tactical communication sub-systems.
Superior Heat Transfer
High thermal conductivity (0.6 W/mK) and thermal stress resistance (300s) facilitate efficient heat dissipation in high-power amplifiers.
Environmental Resilience
Extremely low moisture absorption (0.04%) and high dimensional stability prevent dielectric shifts in humid or extreme field deployments.
Get a Quote / Technical Support
Contact us for customized panel sizes (up to 48"x36"), specialized copper foil treatments, or stack-up recommendations.
New Products
Related Products
Made in Taiwan
| Dielectric Constant (DK): | 2.6 @ 10 GHz |
| Dissipation Factor (DF): | 0.0018 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Technical Standard: | Professional RF Grade |
Made in Taiwan
| Dielectric Constant (Dk): | 2.2 @ 10 GHz |
| Dissipation Factor (Df): | 0.0009 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.66 @ 10 GHz |
| Dissipation Factor (Df): | 0.0030 @ 10 GHz |
| Thermal Conductivity: | 0.70 W/m.k |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.55 @ 10 GHz |
| Dissipation Factor (Df): | 0.0031 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Copper Foil (oz): | 1 / 0.5 oz |
Made in Taiwan
| Design Permittivity (Dk): | 3.52 @ 10 GHz |
| Loss Tangent (Df): | 0.0035 @ 10 GHz |
| Glass Transition (Tg): | > 210 °C (DMA) |
| Flammability: | UL 94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.45 @ 10 GHz |
| Dissipation Factor (Df): | 0.0033 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 2.98 @ 10 GHz |
| Dissipation Factor (Df): | 0.003 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
