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Description & Specification
NP-535B High-Frequency Microwave Bondply
Multilayer Lamination | Dk 3.52 | Df 0.0035 | High Tg > 210°C
The NP-535B is an elite-tier Bonding Material designed for the high-reliability lamination of microwave and millimeter-wave multilayer PCBs. Engineered with a stable design Dk of 3.52 and superior dissipation control, it ensures unwavering electrical performance across the high-frequency spectrum. Its advanced resin rheology is specifically optimized for Signal Defense applications and complex RF stack-ups, providing consistent thickness control and void-free encapsulation for professional communication infrastructure.
Core Electrical Specifications
| Dielectric Constant (Dk) @ 10GHz | 3.50 (Process) / 3.52 (Design) |
| Dissipation Factor (Df) @ 10GHz | 0.0035 (Typical) / 0.0037 (SPDR) |
| Volume / Surface Resistivity | 5x10⁹ MΩ-cm / 5x10⁷ MΩ |
| Glass Transition Temp (Tg) | > 210°C (DMA) |
| Dielectric Breakdown | 40 KV (Spec) |
Thermal & Mechanical Parameters
| Td (Decomposition Temp) | 390°C (5% weight loss) |
| Coefficient of Thermal Expansion (Z) | 30-50 ppm/°C (Before Tg) |
| Thermal Stress Resistance | 300s @ 288°C Solder Dipping |
| Moisture Absorption | 0.10% (D-24/23) |
| Flammability Rating | UL94 V-0 |
Key Tactical Features
Advanced Rheology Control
Precisely engineered resin flow characteristics benefit the lamination process, ensuring optimal hole filling and bonding in high-layer-count RF boards.
Superior Signal Integrity
Super-low dissipation factor (0.0035) minimizes signal attenuation and thermal generation, essential for high-power protection operations.
Tactical Thermal Survival
With a Tg exceeding 210°C and a Td of 390°C, this bondply maintains structural and electrical integrity in high-vibration and extreme heat environments.
Multilayer Synergy
Designed to be fully compatible with high-frequency laminates, allowing for stable impedance matching in hybrid RF stack-up designs.
Get a Quote / Technical Support
Contact us for detailed lamination press cycles, thickness availability, or material compatibility charts for multilayer RF designs.
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Made in Taiwan
| Dielectric Constant (DK): | 2.6 @ 10 GHz |
| Dissipation Factor (DF): | 0.0018 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Technical Standard: | Professional RF Grade |
Made in Taiwan
| Dielectric Constant (Dk): | 2.2 @ 10 GHz |
| Dissipation Factor (Df): | 0.0009 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.0 @ 10 GHz |
| Dissipation Factor (Df): | 0.0022 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.66 @ 10 GHz |
| Dissipation Factor (Df): | 0.0030 @ 10 GHz |
| Thermal Conductivity: | 0.70 W/m.k |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.55 @ 10 GHz |
| Dissipation Factor (Df): | 0.0031 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Copper Foil (oz): | 1 / 0.5 oz |
Made in Taiwan
| Dielectric Constant (Dk): | 3.45 @ 10 GHz |
| Dissipation Factor (Df): | 0.0033 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 2.98 @ 10 GHz |
| Dissipation Factor (Df): | 0.003 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
