-
-
-
Total payment:
-
-
Description & Specification
NP-536H High-Frequency RF Laminate
Dk 3.55 | Df 0.0031 | RO4003C Equivalent | Tg 180°C
The NP-536H is an elite-tier Microwave Substrate designed for mission-critical RF environments requiring stable dielectric constants and ultra-low loss. With a glass transition temperature (Tg) of 180°C, it ensures mechanical dominance during multi-layer processing and high-temperature operation. Engineered for professional Signal Defense, Power Amplifiers (PA), and satellite LNBs, this laminate provides designers with greater flexibility by maintaining consistent impedance across a wide frequency range.
Core Electrical Specifications
| Dielectric Constant (Dk) @ 10GHz | 3.55 (Design) / 3.65 (Process) |
| Dissipation Factor (Df) @ 10GHz | 0.0031 (Typical) / 0.0033 (SPDR) |
| Glass Transition Temp (Tg) | 180°C (DMA) |
| Dielectric Breakdown | 60 KV |
| Volume / Surface Resistivity | 4x10⁸ MΩ-cm / 6x10⁷ MΩ |
Physical & Thermal Parameters
| Substrate Thickness Options (mm) | 0.10 / 0.13 / 0.25 / 0.50 / 0.76 / 1.0 / 1.2 / 1.52 |
| Copper Cladding (oz) | 0.5 oz / 1.0 oz |
| Copper Thickness (mm) | 0.018 mm / 0.035 mm |
| Td (Decomposition Temp) | 380°C (5% weight loss) |
| Moisture Absorption | 0.01% ～ 0.02% |
| Flammability Rating | UL94 94V0 |
Key Tactical Features
Superior Signal Integrity
Low dissipation factor (0.0031) minimizes signal attenuation and thermal gain in high-frequency circuits, essential for wideband applications.
High Thermal Stability
A Tg of 180°C and excellent dimensional stability ensure consistent electrical performance during thermal cycling and high-power operations.
Design Flexibility
Optimized for designers requiring consistent impedance matching across varied dielectric thicknesses, streamlining the development of complex RF stack-ups.
Low Moisture Sensitivity
Ultra-low moisture absorption (0.01%) prevents dielectric drift in high-humidity field tactical deployments or aerospace environments.
Get a Quote / Technical Support
Contact us for customized panel sizes, specific copper treatments, or hybrid microwave stack-up recommendations.
New Products
Related Products
Made in Taiwan
| Dielectric Constant (DK): | 2.6 @ 10 GHz |
| Dissipation Factor (DF): | 0.0018 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Technical Standard: | Professional RF Grade |
Made in Taiwan
| Dielectric Constant (Dk): | 2.2 @ 10 GHz |
| Dissipation Factor (Df): | 0.0009 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.0 @ 10 GHz |
| Dissipation Factor (Df): | 0.0022 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.66 @ 10 GHz |
| Dissipation Factor (Df): | 0.0030 @ 10 GHz |
| Thermal Conductivity: | 0.70 W/m.k |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Design Permittivity (Dk): | 3.52 @ 10 GHz |
| Loss Tangent (Df): | 0.0035 @ 10 GHz |
| Glass Transition (Tg): | > 210 °C (DMA) |
| Flammability: | UL 94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.45 @ 10 GHz |
| Dissipation Factor (Df): | 0.0033 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 2.98 @ 10 GHz |
| Dissipation Factor (Df): | 0.003 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
