NP-536 NP-536 NP-536

Model No: NP-536

Product Datasheet: Download

  • DK (10 GHz): 3.55
  • DF (10 GHz): 0.0031
  • Copper foil (oz): 1/0.035
  • Copper Thickness: 0.5/ 0.018
Quantity:
INQUIRY
  • Low dielectric constant and low dissipation factor at the high-frequency range      
  • Tg:180 (DMA)   
  • Suit for Antenna、PA and LNB application
  • Greater design flexibility by allowing the same impedance
Dk
(10GHz)
Df
(10GHz)
Dielectric Thickness
(mm)
Copper foil
(oz)
Copper Thickness
(mm)
Equivalent
3.55 0.0031 0.10
0.13
0.25
0.50
0.76
1.0
1.2
1.52
1 0.035 RO4003C
S7136H 
IS680
0.5 0.018

Characteristics

Unit

Conditioning

Typical Values

SPEC

Test Method

Permittivity

Process

-

10GHz/23℃

3.65

-

2.5.5.5

Design

-

-

3.55

-

Differential phase length

Loss Tangent

-

10GHz/23℃

0.0028

-

2.5.5.5

0.0033

-

SPDR

Volume resistivity

MΩ-cm

C-96/35/90

4x 108~5 x 109

106 h

2.5.17

Surface resistivity

C-96/35/90

6 x 107~6 x 108

104 h

2.5.17

Arc resistance

SEC

D-48/50+D-0.5/23

450h

60 h

2.5.1

Dielectric breakdown

KV

D-48/50

60 h

40 h

2.5.6

Moisture absorption

%

D-24/23

0.01~0.02

0.35 i

2.6.2.1

Flammability

-

C-48/23/50

94V0

94V0

UL94

Peel strength 1 oz

lb/in

288℃x10” solder floating

5~7

-

2.4.8

Thermal stress

SEC

288℃ dipping

300 h

10 h

2.4.13.1

Pressure cooker 2 hr

(2 atm 121)

SEC

288℃ dipping

300 h

N/A

-

Dimensional stability X-Y axis

%

E-0.5/170

0.010-0.030

0.050 i

2.4.39

Coefficient of thermal expansion

Z-axis before Tg

 

ppm/℃

 

TMA

 

30-50

N/A

2.4.24

Glass transition temp

DMA

180

N/A

2.4.25

Td (5% weight loss)

TGA, 10℃/min

380

325 h

-