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Total payment:
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Description
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Short Specs
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Details Specs
FEATURES
- Extremely Low Loss Tangent
- Product Performance Uniformity
- Excellent Dimensional Stability
APPLICATIONS:
- Military Radar Feed Networks
- Commercial Phased Array Networks
- Low Loss Base Station Antennas
- Missile Guidance Systems
- Digital Radio Antennas
- Filters, Couplers, LNAs
| Dk (10GHz) |
Df (10GHz) |
Dielectric Thickness (mm) |
Copper foil (oz) |
Copper Thickness (mm) |
Equivalent |
| 2.2 | 0.0009 | 0.25 0.5 0.76 1.52 3.2 |
1 | 0.035 | Diclad 880 RT/ duroid 5880 SCGA 500 GF220 |
| 0.5 | 0.018 |
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Characteristics |
Unit |
Conditioning |
Typical Values |
SPEC |
Test Method |
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Permittivity |
Process |
- |
10GHz/23℃ |
2.20 |
- |
2.5.5.5 |
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Design |
- |
2.20 |
Differential phase length |
|||
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Loss Tangent |
- |
10GHz/23℃ |
0.0014 |
- |
2.5.5.5 |
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0.0013 |
SPDR |
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Thermal Coefficient of ɛr |
ppm/°C |
10 GHz -50 to 150 °C |
80 |
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IPC-TM-650 2.5.5.13 |
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Volume resistivity |
MΩ-cm |
C-96/35/90 |
109 |
106 h |
IPC-TM-650 2.5.17 |
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Surface resistivity |
MΩ |
C-96/35/90 |
108 |
104 h |
IPC-TM-650 2.5.17 |
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Arc resistance |
SEC |
D-48/50+D-0.5/23 |
180h |
60 h |
IPC-TM-650 2.5.1 |
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Dielectric breakdown |
KV |
D-48/50 |
45h |
20 h |
IPC-TM-650 2.5.6 |
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Td (5% weight loss) |
℃ |
TGA, 10℃/min |
542.73 |
450 h |
ASTM D3850 |
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CTE (z) (50 - 260°C) |
ppm/℃ |
TMA |
357 |
N/A |
IPC-TM-650 2.4.24 |
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CTE (x,y) (50 - 260°C) |
ppm/℃ |
TMA |
20-30 |
N/A |
IPC-TM-650 2.4.24 |
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Thermal stress |
SEC |
288℃x10” solder dipping |
300 h |
10h |
IPC-TM-650 2.4.13.1 |
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Pressure cooker 2 hr (2 atm 120℃) |
SEC |
288℃x10” solder dipping |
300 h |
N/A |
- |
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Peel strength 1 oz |
lb/in |
288℃x10” solder floating |
10-12 |
6h |
IPC-TM-650 2.4.8 |
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Moisture absorption |
% |
D-24/23 |
0.02 |
0.15↓ |
IPC-TM-650 2.6.2.1 |
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Density (Specific Gravity) |
g/cm3 |
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2.1 |
2.05~2.15 |
ASTM D792 |
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Flammability |
- |
C-48/23/50 |
V-0 |
V-0 |
UL94 |
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Thermal Conductivity |
W/mK |
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0.25 |
0.2h |
ASTM F 433 |
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Dimensional stability X-Y axis |
% |
E-0.5/170 |
0.01-0.03 |
0.05↓ |
IPC-TM-650 2.4.39 |
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Passive Intermodulation |
dBc |
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157 |
<-153 |
: IEC-62037 |
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New Products
Related Products
- DK (10 GHz): 2.6
- DF (10 GHz): 0.0018
- Copper foil (oz): 1/0.5
- Copper Thickness: 0.035/ 0.018
- DK (10 GHz): 3
- DF (10 GHz): 0.0022
- Copper foil (oz): 1/0.035
- Copper Thickness: 0.5/ 0.018
- Low dielectric constant and low dissipation factor at high-frequency range
- High thermal conductivity
- Excellent dimensional stability
- Greater design flexibility by allowing the same impedance
- Suit for Antenna、PA and LNB application
- Manufacturer: Nan Ya Plastic
- DK (10 GHz): 3.55
- DF (10 GHz): 0.0031
- Copper foil (oz): 1/0.035
- Copper Thickness: 0.5/ 0.018
- Super low dissipation factor at high frequency range
- Rheology of resin controlled to benefit the lamination of the boards.
- Flammability meets UL 94 V-0
- DK (10 GHz): 3.45
- DF (10 GHz): 0.0033
- Copper foil (oz): 1/0.035
- Copper Thickness: 0.5/ 0.018
- DK (10 GHz): 2.98
- DF (10 GHz): 0.003
- Copper foil (oz): 1/0.5
- Copper Thickness: 0.035/ 0.018
