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Description & Specification
NP-822 Ultra-High Frequency Substrate
PTFE Matrix | Dk 2.20 | Df 0.0009 | Mission-Critical RF Laminate
The NP-822 is a world-class Microwave Laminate engineered for ultra-low loss transmission in military and aerospace applications. Utilizing a high-purity reinforced PTFE substrate, it delivers an extremely stable Dk of 2.20 with a dissipation factor optimized for millimeter-wave frequencies. Ideal for Signal Defense, missile guidance, and phased array networks, it maintains remarkable dimensional stability (0.01%) and thermal stress resistance, ensuring consistent boresight accuracy and RF performance in the hardest environmental conditions.
Core Electrical Specifications
| Dielectric Constant (Dk) @ 10GHz | 2.20 (Process & Design) |
| Dissipation Factor (Df) @ 10GHz | 0.0009 (Typical) / 0.0013 (SPDR) |
| Passive Intermodulation (PIM) | -157 dBc (Typical) |
| Thermal Coefficient of εr | 80 ppm/°C |
| Dielectric Breakdown | 45 KV (Conditioned) |
| Volume / Surface Resistivity | 10⁹ MΩ-cm / 10⁸ MΩ |
Physical & Thermal Parameters
| Substrate Thickness Options (mm) | 0.25 / 0.50 / 0.76 / 1.52 / 3.21 |
| Copper Cladding (oz) | 0.5 oz / 1.0 oz |
| Copper Thickness (mm) | 0.018 mm / 0.035 mm |
| Td (Decomposition Temp) | 542.73°C (5% weight loss) |
| Moisture Absorption | 0.02% (D-24/23) |
| Flammability Rating | UL94 V-0 |
Key Tactical Features
Extreme Low Loss Dominance
The 0.0009 Df rating minimizes insertion loss and thermal dissipation, maximizing the range and efficiency of high-power radar and communication systems.
Superior Phase Stability
Delivers excellent dimensional stability (up to 0.01%) and a low CTE, ensuring tight phase control in phased array networks and missile guidance sub-systems.
Tactical Thermal Survival
With a Td of 542°C and high dielectric breakdown (45KV), this laminate maintains structural and electrical integrity under extreme thermal stress.
Ultra-Low Outgassing
Extremely low moisture absorption (0.02%) and high-purity PTFE construction make it suitable for space-grade applications and high-vacuum environments.
Get a Quote / Technical Support
Contact us for customized panel sizes, different copper foil treatments (RTF/VLP), or hybrid stack-up recommendations.
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Made in Taiwan
| Dielectric Constant (DK): | 2.6 @ 10 GHz |
| Dissipation Factor (DF): | 0.0018 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Technical Standard: | Professional RF Grade |
Made in Taiwan
| Dielectric Constant (Dk): | 3.0 @ 10 GHz |
| Dissipation Factor (Df): | 0.0022 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.66 @ 10 GHz |
| Dissipation Factor (Df): | 0.0030 @ 10 GHz |
| Thermal Conductivity: | 0.70 W/m.k |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.55 @ 10 GHz |
| Dissipation Factor (Df): | 0.0031 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Copper Foil (oz): | 1 / 0.5 oz |
Made in Taiwan
| Design Permittivity (Dk): | 3.52 @ 10 GHz |
| Loss Tangent (Df): | 0.0035 @ 10 GHz |
| Glass Transition (Tg): | > 210 °C (DMA) |
| Flammability: | UL 94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.45 @ 10 GHz |
| Dissipation Factor (Df): | 0.0033 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 2.98 @ 10 GHz |
| Dissipation Factor (Df): | 0.003 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
