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Description & Specification
NP-530 High-Frequency Microwave Laminate
Dk 2.98 | Df 0.003 | RO4730G3 Equivalent | Tg 180°C
The NP-530 is an elite-tier Microwave Substrate designed for mission-critical RF environments requiring precise dielectric stability and ultra-low loss. With a glass transition temperature (Tg) of 180°C and a design Dk of 2.98, it ensures unwavering electrical performance during high-temperature operation and multi-layer processing. Optimized for professional Antenna arrays, Power Amplifiers (PA), and satellite LNBs, this laminate provides designers with greater flexibility by maintaining consistent impedance matching across diverse mechanical constraints.
Core Electrical Specifications
| Dielectric Constant (Dk) @ 10GHz | 2.98 (Design) / 3.00 (Process) |
| Dissipation Factor (Df) @ 10GHz | 0.003 (Typical) / 0.0036 (SPDR) |
| Glass Transition Temp (Tg) | 180°C (DMA) |
| Dielectric Breakdown | 60 KV |
| Volume / Surface Resistivity | 5x10⁹ MΩ-cm / 5x10⁸ MΩ |
Physical & Thermal Parameters
| Substrate Thickness Options (mm) | 0.15 / 0.27 / 0.50 / 0.78 / 1.0 / 1.2 / 1.54 |
| Copper Cladding (oz) | 0.5 oz / 1.0 oz |
| Copper Thickness (mm) | 0.018 mm / 0.035 mm |
| Td (Decomposition Temp) | 370°C (5% weight loss) |
| Moisture Absorption | 0.01% ～ 0.02% |
| Flammability Rating | UL94 94V0 |
Key Tactical Features
Superior Signal Integrity
The stable 2.98 Dk and ultra-low Df minimize signal attenuation and phase error in high-frequency circuits, critical for wideband satellite sub-systems.
Thermal Stability Dominance
A Tg of 180°C and excellent dimensional stability (0.01%) ensure consistent electrical performance and PTH reliability during thermal cycling.
Design Flexibility
Engineered to allow consistent impedance design across multiple dielectric thicknesses, providing greater freedom for complex RF stack-ups.
Environmental Resilience
Ultra-low moisture absorption (0.01%) prevents dielectric shifts and mechanical failure in high-humidity field tactical deployments.
Get a Quote / Technical Support
Contact us for customized panel sizes, specific copper treatments (RTF/VLP), or Rogers RO4730G3 equivalent analysis.
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Made in Taiwan
| Dielectric Constant (DK): | 2.6 @ 10 GHz |
| Dissipation Factor (DF): | 0.0018 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Technical Standard: | Professional RF Grade |
Made in Taiwan
| Dielectric Constant (Dk): | 2.2 @ 10 GHz |
| Dissipation Factor (Df): | 0.0009 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.0 @ 10 GHz |
| Dissipation Factor (Df): | 0.0022 @ 10 GHz |
| Copper Foil (oz): | 1 / 0.5 oz |
| Flammability: | UL94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.66 @ 10 GHz |
| Dissipation Factor (Df): | 0.0030 @ 10 GHz |
| Thermal Conductivity: | 0.70 W/m.k |
| Flammability: | UL 94V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.55 @ 10 GHz |
| Dissipation Factor (Df): | 0.0031 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Copper Foil (oz): | 1 / 0.5 oz |
Made in Taiwan
| Design Permittivity (Dk): | 3.52 @ 10 GHz |
| Loss Tangent (Df): | 0.0035 @ 10 GHz |
| Glass Transition (Tg): | > 210 °C (DMA) |
| Flammability: | UL 94 V-0 |
Made in Taiwan
| Dielectric Constant (Dk): | 3.45 @ 10 GHz |
| Dissipation Factor (Df): | 0.0033 @ 10 GHz |
| Glass Transition (Tg): | 180 °C (DMA) |
| Flammability: | UL 94V-0 |
