NP-530

Characteristics

Unit

Conditioning

Typical Values

SPEC

Test Method

Permittivity

Process

10GHz/23℃

3.00

--

2.5.5.5

Design

2.98

Differential phase length

Loss Tangent

-

10GHz/23℃

0.0035

2.5.5.5

0.0036

SPDR

Volume resistivity

MΩ-cm

C-96/35/90

4x 10⁸~5 x 10⁹

10⁶ h

2.5.17

Surface resistivity

MΩ

C-96/35/90

5 x 10⁷~5 x 10⁸

10⁴ h

2.5.17

Arc resistance

SEC

D-48/50+D-0.5/23

120h

60 h

2.5.1

Dielectric breakdown

KV

D-48/50

60 h

40 h

2.5.6

Moisture absorption

%

D-24/23

0.01~0.02

0.35 i

2.6.2.1

Flammability

-

C-48/23/50

94V0

94V0

UL94

Peel strength 1 oz

lb/in

288℃x10” solder floating

6~8

-

2.4.8

Thermal stress

SEC

288℃ dipping

300 h

10 h

2.4.13.1

Pressure cooker 2 hr

(2 atm 121℃)

SEC

288℃ dipping

300 h

N/A

-

Dimensional stability X-Y axis

%

E-0.5/170

0.010-0.030

0.050 i

2.4.39

Coefficient of thermal expansion

Z-axis before Tg

ppm/℃

TMA

50-80

N/A

2.4.24

Glass transition temp

℃

DMA

180

N/A

2.4.25

Td (5% weight loss)

℃

TGA, 10℃/min

370

325 h

-